Advanced Packaging Companies and Market Forecast
The global advanced packaging market size to rise from USD 40.34 in 2025 to USD 57.32 by 2030. North America held considerable market share of 29.87% in 2023 while Asia-Pacific is expected to grow at a fastest CAGR of 9.66% owing to the strong semiconductor manufacturing base, government support and the presence of key players like TSMC, Samsung, and SK Hynix.
Recent Developments by Key Market Players
- In October 2024, in an effort to further develop the semiconductor ecosystem in Arizona, Amkor Technology, Inc. and TSMC revealed that they had established a memorandum of understanding to work together and provide advanced packaging and testing capabilities to the state. The contract states that TSMC will hire Amkor to provide comprehensive advanced packaging and testing services at their proposed Peoria, Arizona, facility. TSMC will use these services to help its clients, especially those who leverage its state-of-the-art wafer fabrication facilities in Phoenix. Amkor's back-end facility and TSMC's front-end fab will speed up product cycle times altogether.
- In October 2024, Kiwimoore and Faraday Technology Corporation declared that their 2.5D packaging platform, which they co-developed, is now successfully moving into the large-scale production phase. Kiwimoore's Chiplet interconnect and NDSA (network domain specific accelerator) products are integrated into the one-stop advanced packaging platform and service that Faraday and Kiwimoore developed together. This collaboration demonstrates the important developments both companies have made in the Chiplet sector.
Advanced Packaging Market Players
- ASE Technology Holding Co. Ltd.
- Amkor Technology
- Taiwan Semiconductor Manufacturing Company (TSMC)
- Intel Corporation
- Samsung Electronics Co. Ltd.
- Jiangsu Changjiang Electronics Technology Co. Ltd. (JCET)
- Siliconware Precision Industries Co. Ltd. (SPIL)
- Powertech Technology Inc.
- STATS ChipPAC Pte. Ltd.
- ChipMOS Technologies Inc.
- Fujitsu Semiconductor Ltd.
- Texas Instruments
- Analog Devices
- Deca Technologies
- HANA Micron Inc.
Top Consignees in Smart Packaging (RFID and Sensors) Market (Nov 2021 – Dec 2024)
| Consignee Name |
Quantity |
| ACUITY BRANDS LIGHTING |
3,318,902 |
| AMERICAN HYPERION SOLAR LLC |
5,684,114 |
| AX FOCUS INTERNATIONAL INC |
5,464,810 |
| COOPER LIGHTING SOLUTIONS LLC |
12,102,267 |
| FUJIFILM RECORDING MEDIA USA |
4,542,853 |
| GREEN FROG SYSTEMS INC |
9,681,725 |
| JA SOLAR USA INC |
3,138,608 |
