Hermetic Packaging Companies and Competitive Landscape
The global hermetic packaging market size to rise from USD 5.03 bn in 2025 to USD 7.89 billion by 2034. Asia Pacific takes the lead in the global hermetic packaging market by 42% market share while North America has secured a formidable position as the second-largest region.
Competitive landscape
Several key players characterize the competitive landscape of the hermetic packaging refrigerant market. Major companies in this market include Schott AG., Willow Technologies, AMETEK Inc., Amkor Technology, Materion Corporation, Sinclair Manufacturing Company, SGA Technologies, Micross Components Inc., Egide SA and Televec. These companies focus on strategies such as mergers and acquisitions, product innovations, and expanding their regional presence to gain a competitive edge. The market is also influenced by changes in regulatory requirements and consumer preferences shifts, driving the need for innovative and sustainable hermetic packaging refrigerant solutions.
Hermetic Packaging Market Key Players
- Schott AG
- Willow Technologies
- AMETEK Inc.
- Amkor Technology
- Materion Corporation
- Sinclair Manufacturing Company
- SGA Technologies
- Micross Components Inc.
- Egide SA
- Televec
Recent Developments
- In May 2023, Macross Expanded its Offering of Packaging and substrate capabilities for Multi-Chip Modules, ASICs, and PCBs with the Acquisition of Technograph Microcircuits Ltd.
- In July 2022, Electronic Products, Inc. was acquired by Douglas Electrical Component, a producer of hermetic interconnects based on epoxy.
- In November 2022, QnnectTM, an Arcline Investment Management portfolio business, acquired Hermetic Solutions Group ("HSG"). It enables Qnnect to expand its services into airtight containers and enhance its current range of speciality interconnect solutions.
- In January 2021, Cristek Interconnects, Inc., a top producer of specialist interconnect products and assemblies, was purchased by Hermetic Solutions Group ("HSG" or the "Company"), a global supplier of highly engineered performance and protection solutions for mission-critical microelectronics.
