Organic Substrate Packaging Materials Companies and Market Forecast
The global organic substrate packaging materials market size reached US$ 15.60 billion in 2023 and is projected to hit around US$ 28.41 billion by 2034, expanding at a CAGR of 5.60% during the forecast period from 2025 to 2034.
Organic Substrate Packaging Materials Market Top Companies
US Import Data: Organic Substrate Packaging Materials including Bagasse Trays, Tableware, and Rice Husk Ash
| CONSIGNEE NAME |
SHIPPER NAME |
PRODUCT DESCRIPTION |
QUANTITY |
WEIGHT |
| VERITIV OPERATING COMPANY |
UNISOURCE TRADE SHANGHAI CO LIMITED |
BAGASSE FOOD TRAY |
724 |
10802 |
| WHI PACKAGING |
LONGYAN YADA TRADE CO LIMITED |
BAGASSE TABLEWARE |
1200 |
4775 |
| VESUVIUS USA |
SILICON INDIA |
RICE HUSK ASH, HS. CODE : 2621900040 PCS OF BIG BAGS ONWOODEN PALLETS INCLUDING A WOODEN FIXTUREBETWEEN UPPER & LOWER BAGS.EACH BIG BAGCONTAINS 40 NOS. OF PLASTIC BAGS EACH HAV ING 11.5 KGS OF RICE HUSK ASH. (RICE HU SK ASH) PO NO: -1672418 OL DTD.31.01.2 |
40 |
18960 |
Latest Announcements by Market Leaders
- In September 2024, Intel senior vice president and general manager of Assembly and Test Development, Babak Sabi, expressed, “after a decade of research, Intel has achieved industry-leading glass substrates for advanced packaging. We look forward to delivering these cutting-edge technologies that will benefit our key players and foundry customers for decades to come.”
Recent Developments
- In June 2024, TOPPAN Inc. announced the launch of Coreless Organic Interposer for Next-Generation Semiconductors—the World’s First Supporting Standalone Electrical Inspection.
- In September 2024, Intel announced the launch of next-generation advanced packaging glass substrate technology.
