Packaging Inspection Systems Manufacturers and Market Growth
The global packaging inspection systems market size to reach US$ 988.92 million by 2034, expanding from US$ 568.23 million in 2025. North America dominated the market in 2024 while Asia Pacific is expected to grow at a significant rate in the market during the forecast period.
Global Packaging Inspection Systems Market Key Players
New Advancements in Packaging Inspection Systems Industry
- In August 2024, Antares Vision Group, automation company, has unveiled its new Food Safety Solution, a cloud-based platform made to help owners of food and beverage brands increase supply chain transparency, precision traceability, and regulatory compliance. The Antares Vision Group's ACSIS technology created the system. With the help of the labeling solution that has the necessary features to satisfy regulatory compliance, especially those pertaining to the FDA's Food Safety Modernization Act (FSMA), manufacturers and distributors should be able to track raw materials, manage purchase orders, and get status updates on subcontractor deliveries.
- In April 2024, Onto Innovation Inc., semiconductor manufacturing company announced the establishment of the company's Packaging Applications Center of Excellence (PACE), a first-of-its-kind facility in the U.S. dedicated to panel-level packaging (PLP) breakthroughs enabling 2.5D and 3D chiplet topologies and Al packages. From producers of panel packages and IC substrates to providers of process equipment and materials, cooperating partners are essential process steps throughout the supply chain. Among the collaborators are Taiyo Ink Mfg. Co., Ltd., LPKF Laser & Electronics SE, MKS Instruments, Resonac Corporation, Evatec, Corning, ASMPT, Lam Research, and numerous others.
Latest Announcements by Packaging Inspection Systems Industry Leaders:
- In September 2024, the CEO of Gamtek, Rafi Amit, made a statement regarding the introduction of our fifth-generation Eagle platform. It pushes the limits of performance for metrology and inspection, and I anticipate that it will solidify Camtek Ltd.'s leading position in the advanced packaging sectors for both 2D inspection and 3D metrology. This system is the first of several new products that Camtek Ltd. has been developing recently. It will offer metrology and inspection solutions for the next generation of Advanced Packaging technologies, which are distinguished by hybrid bonding interconnects and fine-pitch micro bumps.
