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Electronic Packaging Market Size to Expand at 16.0% CAGR

Electronic Packaging Market Size, Innovation & Investment Trends

The global electronic packaging market, valued at USD 1.87 billion in 2024, is anticipated to reach USD 8.24 billion by 2034, growing at a CAGR of 16.0% over the next decade. Electronic packaging leading market players are Amkor Technology, ASE Group, FUJITSU LIMITED, Intel Corporation, Texas Instruments, Apple, Sealed Air Corporation, Nantong Fujitsu Microele, KYOCERA CORPORATION, Powertech Technology Inc and Advanced Semiconductor Engineering Inc.

Introduction

  • Research Objective
  • Scope of the Study
  • Definition and Taxonomy

Research Methodology

  • Research Approach
  • Data Sources
  • Assumptions

Executive Summary

  • Synopsis 
  • Analyst Recommendations

Market Overview 

  • Market Dynamics
    • Market Drivers
    • Market Restraints
    • Market Opportunities
  • Value chain analysis
    • Raw Material Sourcing
    • Manufacturing Process
    • Logistics & Transportation
    • Buyer Preferences
  • Trends
    • Market Trends
    • Technological Trends
  • Porter’s Five Forces Analysis
    • Bargaining Power of Suppliers
    • Bargaining Power of Buyers
    • Threat of Substitute
    • Threat of New Entrants
    • Degree of Competition
  • PESTLE Analysis for 5 Leading Countries
  • Regulatory Framework for Leading Countries/Regions
  • Supply Demand Analysis
    • Production & Consumption Statistics
    • Export Import Statistics
    • Price Trend Analysis

Global Electronic Packaging Market Assessment

  • Overview
  • Global Electronic Packaging Market Size Value (US$) and Volume (Billion Tons), By Material Type (2021 – 2033)
    • Plastic
    • Paper & Paperboard
    • Metal
    • Glass
    • Others
  • Global Electronic Packaging Market Size Value (US$) and Volume (Billion Tons), By Product Type (2021 – 2033)
    • Corrugated Box
    • Thermoformed Trays
    • Paper Box
    • Blister Packs
    • Clamshells
  • Global Electronic Packaging Market Size Value (US$) and Volume (Billion Tons), By End Use Type (2021 – 2033)
    • Consumer Electronics
    • Automotive
    • Aerospace and Defence
    • Healthcare
    • Others
  • Global Electronic Packaging Market Size Value (US$) and Volume (Billion Tons), By Region Type (2021 – 2033)
    • Asia Pacific
    • North America
    • Europe
    • LAMEA

Asia Pacific Electronic Packaging Market Assessment

  • Overview
  • Asia Pacific Electronic Packaging Market Size Value (US$) and Volume (Billion Tons), By Material Type (2021 – 2033)
    • Plastic
    • Paper & Paperboard
    • Metal
    • Glass
    • Others
  • Asia Pacific Electronic Packaging Market Size Value (US$) and Volume (Billion Tons), By Product Type (2021 – 2033)
    • Corrugated Box
    • Thermoformed Trays
    • Paper Box
    • Blister Packs
    • Clamshells
  • Asia Pacific Electronic Packaging Market Size Value (US$) and Volume (Billion Tons), By End Use Type (2021 – 2033)
    • Consumer Electronics
    • Automotive
    • Aerospace and Defence
    • Healthcare
    • Others

North America Electronic Packaging Market Assessment

  • Overview
  • North America Electronic Packaging Market Size Value (US$) and Volume (Billion Tons), By Material Type (2021 – 2033)
    • Plastic
    • Paper & Paperboard
    • Metal
    • Glass
    • Others
  • North America Electronic Packaging Market Size Value (US$) and Volume (Billion Tons), By Product Type (2021 – 2033)
    • Corrugated Box
    • Thermoformed Trays
    • Paper Box
    • Blister Packs
    • Clamshells
  • North America Electronic Packaging Market Size Value (US$) and Volume (Billion Tons), By End Use Type (2021 – 2033)
    • Consumer Electronics
    • Automotive
    • Aerospace and Defence
    • Healthcare
    • Others

Europe Electronic Packaging Market Assessment

  • Overview
  • Europe Electronic Packaging Market Size Value (US$) and Volume (Billion Tons), By Material Type (2021 – 2033)
    • Plastic
    • Paper & Paperboard
    • Metal
    • Glass
    • Others
  • Europe Electronic Packaging Market Size Value (US$) and Volume (Billion Tons), By Product Type (2021 – 2033)
    • Corrugated Box
    • Thermoformed Trays
    • Paper Box
    • Blister Packs
    • Clamshells
  • Europe Electronic Packaging Market Size Value (US$) and Volume (Billion Tons), By End Use Type (2021 – 2033)
    • Consumer Electronics
    • Automotive
    • Aerospace and Defence
    • Healthcare
    • Others

LAMEA Electronic Packaging Market Assessment

  • Overview
  • LAMEA Electronic Packaging Market Size Value (US$) and Volume (Billion Tons), By Material Type (2021 – 2033)
    • Plastic
    • Paper & Paperboard
    • Metal
    • Glass
    • Others
  • LAMEA Electronic Packaging Market Size Value (US$) and Volume (Billion Tons), By Product Type (2021 – 2033)
    • Corrugated Box
    • Thermoformed Trays
    • Paper Box
    • Blister Packs
    • Clamshells
  • LAMEA Electronic Packaging Market Size Value (US$) and Volume (Billion Tons), By End Use Type (2021 – 2033)
    • Consumer Electronics
    • Automotive
    • Aerospace and Defence
    • Healthcare
    • Others

Company Profile

  • Amkor Technology
    • Company Overview
    • Geographic Footprints
    • Financial Performance
    • Product Portfolio
    • SWOT Analysis
    • R&D Efforts
    • Recent Developments & Strategic Collaborations
      • Product Launch/M&A/Technical Collaboration
  • ASE Group
  • FUJITSU LIMITED
  • Intel Corporation
  • Texas Instruments
  • Apple
  • Sealed Air Corporation
  • Nantong Fujitsu Microele
  • KYOCERA CORPORATION
  • Powertech Technology Inc
  • Advanced Semiconductor Engineering Inc.

Conclusion & Recommendations

  • Insight Code: 5151
  • No. of Pages: 150+
  • Format: PDF/PPT/Excel
  • Published: February 2025
  • Report Covered: [Revenue + Volume]
  • Historical Year: 2021-2022
  • Base Year: 2023
  • Estimated Years: 2024-2033

About The Author

Deepa Pandey is a skilled market research professional with over three years of experience specializing in packaging. Her expertise spans various aspects of the packaging sector, including regulatory compliance, packaging design, material innovations, and sustainability. Deepa's passion for improving packaging solutions in the healthcare industry drives her to stay ahead of emerging trends and innovations that aim to enhance safety, efficiency, and environmental sustainability.

Throughout her career, Deepa has collaborated with leading healthcare companies, conducting in-depth research to identify key market trends and shifts in consumer preferences. Her expertise includes packaging solutions that optimize drug delivery, ensure product integrity, and improve patient compliance. She is also focused on innovations in sustainable packaging, including the use of recyclable and biodegradable materials, as the industry increasingly seeks eco-friendly solutions.

Deepa's market research reports provide businesses with valuable insights into regulatory requirements, technological advancements, and competitive dynamics within healthcare packaging. By delivering actionable data, she has helped companies refine their packaging strategies, improve product safety, and maintain compliance with stringent industry standards.

FAQ's

Thermal management in electronic packaging involves dissipating heat generated by electronic components to prevent overheating and ensure optimal performance and longevity. Heat sinks, thermal pads, fans, and other cooling solutions are commonly used for this purpose.

Effective electronic packaging enhances product reliability by protecting components from environmental stressors and maintaining stable operating conditions. Proper thermal management also prevents overheating, which can degrade performance and shorten the lifespan of electronic devices.

Emerging trends in electronic packaging include the miniaturization of components, the adoption of advanced materials and manufacturing processes (such as additive manufacturing and 3D printing), the integration of IoT (Internet of Things) technologies, and the development of flexible and stretchable electronics.

Press Information Bureau (PIB), Oberlo, IBEF, Springer, IBE Electronics, Volza, Phys.org.