3D Semiconductor Packaging Key Players and their Developments
The global 3D semiconductor packaging market size was valued at US$ 11.00 billion in 2023 and is projected to hit US$ 57.19 billion by 2034, upsurging at a CAGR of 16.17% during the forecast period from 2024 to 2034. With widespread digitalization, 3D semiconductor industry is growing that is directly boosting the demand for 3D semiconductor packaging market.
3D Semiconductor Packaging Market Companies
- International Business Machines Corportation
- Suss Microtec AG
- Intel Corporation
- Taiwan Semiconductor Manufacturing Company Ltd.
- ASE Group
- Siliconware Precision Industries
US Import Data - Semiconductor Equipment and Components
| CONSIGNEE_NAME |
SHIPPER_NAME |
SUMOFQUANTITY |
SUMOFWEIGHT |
| APPLIED MATERIAL INC |
KS SYSTEM CO LIMITED |
1215 |
421090 |
| HQ PACK OF CONNECTICUT INC |
ASML NETHERLANDS B V |
1155 |
505060 |
| ASML US LLC |
ASML NETHERLANDS B V |
46 |
12410 |
| TSMC ARIZONA CORP |
TOKYO ELECTRON LIMITED |
46 |
41395 |
| ITEST INC |
HON PRECISION INC |
2 |
4160 |
| TYCO INTERNATIONAL DE MEXICO |
VACUUMSCHMELZE GMBH AND CO |
4 |
2477 |
New Advancements in 3D Packaging Semiconductor Industry
- In September 2024, Electroninks, company focused on manufacturing advanced semiconductor packaging, revealed the introduction of the company’s advanced conductive copper ink line. The new copper ink lowers clients' total ownership costs and offers more production flexibility to Electroninks' already industry-leading array of metal complex inks. The new copper ink line from Electroninks will be on display from September 4-6, 2024, at booth Q5152 in Hall 2 at SEMICON Taiwan.
- In April 2024, Onto Innovation Inc., semiconductor manufacturing company, uneviled the inauguration of the company’s Packaging Applications Center of Excellence (PACE). The Packaging Applications Center of Excellence (PACE) facility in the U.S. focused to panel-level packaging (PLP) revolution enabling 2.5D and 3D chiplet architectures and AI packages.
